Method for handling and processing microelectronic-device substrate assemblies

ABSTRACT

Methods for selectively moving a microelectronic-device substrate assembly in a processing machine having a first side, a second side opposite the first side, and a processing path extending from the first side to the second side. The processing machine can also include a cassette proximate to a second side of the processing station that moves to position a substrate at the processing path. In one aspect of the invention, the substrate handling apparatus includes a guide member attached to the processing machine, an arm slidably attached to the guide member, and a clamp attached to the arm. The guide member is generally fixedly attached to the processing machine, and the guide member generally has a shape corresponding to the processing path. The arm can include a first section moveably attached to the guide member to translate along the guide member, and a second section projecting from the first section to position at least a portion of the second section at least proximate to the processing path. The clamp is coupled to the second section of the arm in alignment with the processing path. A motor is coupled to the arm via a drive member to move the arm along the guide member between a first position in which the clamp is near the first side of the plate assembly and a second position in which the clamp is near the cassette at the second side of the plate assembly.

TECHNICAL FIELD

[0001] The present invention relates to methods for handling andprocessing microelectronic-device substrate assemblies, such assemiconductor wafers, field emission displays and other types ofsubstrates with one or more microelectronic-devices. More particularly,the present invention relates to handling and processing substrateassemblies when the substrate assemblies are attached to a backing filmstretched over a frame.

BACKGROUND OF THE INVENTION

[0002] Microelectronic-device substrate assemblies are typicallysemiconductor substrates used in the manufacturing of semiconductordevices, field emission displays and other microelectronic devices. In atypical application for manufacturing semiconductor devices, thesubstrate assemblies are semiconductor wafers upon which a plurality ofindividual devices are formed in several processing steps. Memorydevices, for example, are fabricated on 6-12 inch wafers that provideenough surface area to fabricate several hundred individual memorydevices on a single substrate assembly. After the circuits of theindividual devices have been constructed, the substrate assembly is cutto separate the devices from one another, and then the individualdevices are often packaged for mounting to a printed circuit boardassembly.

[0003] One aspect of manufacturing or using substrate assemblies ishandling the substrate assemblies in processing machines. Substrateassemblies are fairly delicate structures that may chip or crack, andthe integrated circuits of the individual devices are very delicatestructures that may be damaged or destroyed by static electricity. Toprotect the substrate assemblies during certain stages of processing,the substrate assemblies are attached to a backing film that isstretched over a metal frame to avoid directly contacting the substrateassemblies with the handling equipment. In a typical fabricationprocess, for example, substrate assemblies are coupled to frames by thebacking film for processing in a dicing machine that cuts the substrateassemblies to separate the devices from one another. Additionally,because the backing film may stretch and cause difficulties in cuttingthe substrate assemblies in the dicing machines, the frames and thesubstrate assemblies are placed in an “expander” machine that shrinksthe backing film until it is taut. Existing expander machines, however,have many drawbacks that make it difficult to handle substrateassemblies.

[0004]FIG. 1 is an isometric view partially illustrating an existingexpander machine 10 that has a processing station 20, a loader 30 and acassette 50. The processing station 20 has a plate assembly with a firstplate 22 and a second plate 24 spaced apart from one another by a gap26. A number of posts 27 attached to the table 12 support the first andsecond plates 22 and 24 to position the plate gap 26 at a desiredelevation with respect to the cassette 50. The processing station 20 hasa first side 28 facing the loader 30 and a second side 29 facing thecassette 50.

[0005] The loader 30 is mounted to a base 31 proximate to the first side28 of the processing station 20. The loader 30 has a housing 32, a motor33 attached to the housing 32, and a spring-loaded tape assembly 34 witha thin metal tape 36 that projects from the housing 32. The tape 36includes a plurality of holes 38 arranged in a line along the length ofthe tape 36 to receive the teeth of a sprocket 39 attached to an outputshaft of the motor 33. A clamp 40 is attached to the end of the tape 36.The clamp 40 has a pair of clips 42, and each clip 42 has an upperfinger and a lower finger that are biased toward one another.

[0006] In operation, the motor 33 turns the sprocket 39 to move the tape36 and the clamp 40 along a processing path P through the gap 26 betweenthe first and second plates 22 and 24. For example, to remove a selectedsubstrate assembly from the cassette 50, the motor 33 drives the tape 36out of the tape assembly 34 until the clamp 40 engages a frame 52 towhich the selected substrate assembly is attached via a backing film.The motor 33 then reverses the rotation of the sprocket 39 to pull theframe 52 and selected substrate assembly out of the wafer cassette 50and into the plate gap 26 between the first and second plates 22 and 24at the processing station 20. The spring-loaded tape assembly 34accordingly recoils a portion of the tape 36 in a manner similar to atape measure. After the substrate assembly has been processed at theprocessing station 20, the motor 33 rotates the sprocket 39 to drive thetape 36 from the tape assembly 34 until the frame 52 and selectedsubstrate assembly are replaced in the wafer cassette 50. The motor 33then reverses the rotation of the sprocket 39 very quickly to disengagethe clips 42 from the frame 52 and retract the clamp 40 to the loader30.

[0007] One drawback with the expander machine 10 is that the loader 30may not accurately drive the tape 36 and the clamp 40 along theprocessing path P to accurately pick up, position and release the frames52 for processing the substrate assemblies. More particularly, the thinmetal tape 36 often cracks in a line between the holes 38. The teeth ofthe sprocket 39 may accordingly pass through the cracks between theholes 38 in the thin metal tape instead of pushing against the portionof the tape 36 between the holes 38. The cracks in the tape 36 betweenthe holes 38 typically develop to a point at which the loader 30 isinoperable and the tape assembly 34 must be replaced. Repairing theloader 30, however, results in down-time for the expander machine 10.Thus, the durability of the tape assembly 34 is a significant drawbackin handling microelectronic-device substrate assemblies in the expandermachine 10.

[0008] Another problem of the expander machine 10 is that the clamp 40may hit one of the first and second plates 22 and 24 of the processingstation 20 as the loader 30 drives the tape 36 from the loader 30 to thecassette 50. This problem arises because the clamp 40 causes the thintape 36 to bend downward as the clamp 40 moves from the loader 30 towardthe processing station 20. The vertical displacement of the clamp 40accordingly increases with increasing distance from the loader 30 suchthat the height of the loader 30 is generally adjusted at the initialset-up so that the clamp 40 passes through the plate gap 26 on both thefirst and second sides 28 and 29 of the processing station 20. Moreover,as the thin tape 36 wears and cracks develop between the holes 38, thebend radius of the tape 36 changes over time causing the verticaldisplacement of the clamp 40 along the processing path to also change.The clamp 40 may even hit one of the first or second plates 22 or 24when the tape 36 wears down after a period of use. When this occurs, theheight of the loader 30 must be readjusted to compensate for the changesin the integrity of the tape 36. Adjusting the height of the loader 30so that the clamp 40 passes through the gap 26 of the processing station20 is a difficult and time-consuming process because it is generally atrial-and-error procedure. Therefore, constantly adjusting andreadjusting the loader 30 so that the clamp 40 can “shoot the gap” ofthe plate gap 26 also causes down-time for the expander machine 10.

[0009] Still another drawback of the expander machine 10 is that theclamp 40 may not positively engage or disengage the frames 52. Theframes 52 wear down the interior surfaces of the clips 42 causing a gapto form between the fingers of each clip 42. After the frames 52 weardown the interior surfaces of the clips 42, the clamp 40 may notsufficiently engage a frame 52 to pull the frame 52 out of the cassette50. Therefore, the durability of the clamp 40 also presents anotheroperating concern of using the expander machine 10.

SUMMARY OF THE INVENTION

[0010] The present invention is directed towards methods for selectivelymoving a microelectronic-device substrate assembly in a processingmachine, and methods of operating such processing machines. A typicalprocessing machine includes a processing station having a first side, asecond side opposite the first side, and a processing path extendingfrom the first side to the second side. The processing machine can alsoinclude a moveable cassette proximate to a second side of the processingstation that moves to position a selected substrate assembly at theprocessing path.

[0011] In one aspect of the invention, a substrate handling apparatusincludes a guide member attached to the processing machine, an armslidably attached to the guide member, and a clamp attached to the arm.The guide member is generally fixedly attached to the processingmachine, or it is otherwise fixed with respect to the processing path.The guide member also generally has a shape extending along theprocessing machine at least substantially parallel to the processingpath. The guide member, for example, can be an elevated beam above thetable, a rail on the table, a channel in the table, a threadedball-screw, or other structures that can guide the arm along theprocessing path.

[0012] The arm of the guide assembly can include a first sectionmoveably attached to the guide member to translate along the guidemember, and a second section projecting from the first section. Thefirst and second arm sections are configured to position at least aportion of the second section at least proximate to the processing path.For example, the first arm section can be a bracket attached to theguide member and the second arm section can be a bar projecting from thebracket transverse to the processing path to position a portion of thebar over the processing path. The clamp is coupled to the second sectionof the arm at the clamp location in alignment with the processing path.The clamp generally has a pair of jaws to releasably grip a selectedframe supporting a selected substrate assembly.

[0013] The substrate handling apparatus also includes a drive mechanismhaving a motor and a drive member. The drive member is coupled to boththe motor and the arm to transfer an output from the motor to the arm.The motor can be a servo motor, and the drive member can be one or morebelts coupled to sprockets or pulleys to transfer the rotational outputof the motor to a linear action along the guide member.

[0014] In a particular aspect of the invention, the motor and the drivemember selectively move the arm along the guide member between a firstposition in which the clamp is near the first side of the plate assemblyand a second position in which the clamp is near the cassette at thesecond side of the plate assembly. The drive mechanism accordingly movesthe clamp at an elevation along the processing path through theprocessing station such that the clamp holds a selected substrateassembly at the processing station in the first position, or the clampgrips or releases the selected frame and substrate assembly at thecassette in the second position. For example, the clamp can have anactuator coupled to a jaw assembly with first and second jaws. When theclamp is in the second position, the actuator closes the jaws to gripthe selected frame. The drive mechanism then moves the arm along theguide member to carry the substrate assembly from the second position tothe first position at the processing station. After the substrateassembly has been processed, the drive mechanism moves the arm backalong the guide member until the clamp is in the second position. Theactuator then opens the clamp jaws to release the selected frame andplace the selected frame and substrate assembly back in the cassette.

BRIEF DESCRIPTION OF THE DRAWINGS

[0015]FIG. 1 is an isometric view of an existing expander machine with aloader in accordance with the prior art.

[0016]FIG. 2 is an isometric view of an expander machine with a handlingassembly used in a method in accordance with one embodiment of theinvention.

[0017]FIG. 3 is a front elevational view partially illustrating theexpander machine and the handling assembly of FIG. 2.

[0018]FIG. 4 is an isometric view of an embodiment of a clamp assemblyfor use with a handling system used in a method in accordance with theinvention.

[0019]FIG. 5 is an isometric view of an embodiment of another clampassembly for use with a handling system used in a method in accordancewith the invention.

[0020]FIG. 6 is an isometric view of another embodiment of a handlingassembly used in a method in accordance with another embodiment of theinvention.

[0021]FIG. 7 is an isometric view of yet another embodiment of ahandling system used in a method in accordance with yet anotherembodiment of the invention.

[0022]FIG. 8 is an isometric view of still another embodiment of ahandling system used in a method in accordance with still anotherembodiment of the invention.

DETAILED DESCRIPTION OF THE INVENTION

[0023] The present invention is directed toward methods formanufacturing and handling of microelectronic-device substrateassemblies. Many specific details of certain embodiments of theinvention are set forth in the following description, and in FIGS. 2-8,to provide a thorough understanding of these particular embodiments. Oneskilled in the art, however, will understand that the invention may haveadditional embodiments, or that the invention may be practiced withoutseveral of the details described in the following description.

[0024]FIG. 2 is an isometric view of an expander machine 110 with twowafer handling apparatuses 130 in accordance with one embodiment of theinvention. The expander machine 110 has a cassette 114 attached to atable 112, first and a second processing stations 120 a and 120 b(collectively referred to in the text by reference number 120)positioned at one side of the cassette 114, and one substrate handlingapparatus 130 for each of the processing stations 120. The processingstations 120 are generally similar to one another, and the substratehandling apparatus 130 at the processing stations are also similar toone another. Thus, for the purpose of brevity, the first processingstation 120 a and the substrate handling apparatus 130 at the firstprocessing station 120 a are described herein with the understandingthat like reference numbers refer to like parts in the second processingstation 120 b.

[0025] The cassette 114 holds a plurality of frames 115 andmicroelectronic-device substrate assemblies 117 (only one assemblyshown). In a typical application, a thin backing film 116 is attached toeach frame 115, and a microelectronic-device substrate assembly 117 isattached to the backing film 116. The substrate assemblies 117 aregenerally coupled to the frames 115 via the backing film 116 to providea rigid frame to handle the substrate assemblies 117 without directlycontacting the substrate assemblies 117 with the handling equipment.

[0026] The first processing station 120 a has first and second plates122 and 124 spaced apart from one another by a plate gap 126.Additionally, the first plate 122 generally has a first slot 125 at afirst side 128 of the processing station 120 a, and a second slot 127 ata second side 129 of the processing station 120 a. The first and secondslots 125 and 127 are aligned with a processing path P₁ extendingthrough the first processing station 120 a to the cassette 114. Thesecond plate 124 is generally mounted to the table 112 by a number ofposts (not shown), and the first plate 122 is spaced apart from thesecond plate 124 by a number of spacers (not shown). The gap 126 betweenthe first and second plates 122 and 124 is accordingly positioned at aselected elevation with respect to the cassette 114.

[0027] The second processing station 120 b has only a first plate 122attached to the frame 112 by a number of posts (not shown). A singleslot 125 extends along the first plate 122 of the second processingstation 120 b from a first side 128 to a second side 129. The slot 125defines a processing path P₂ of the second processing station 120 b. Inlight of the structure of the processing stations 120 and the cassette114, an embodiment of a substrate handling apparatus 130 will now bedescribed.

[0028]FIG. 3 is a front elevational view of the substrate handlingapparatus 130 at the first processing station 120 a of the expandermachine 110. Referring to FIGS. 2 and 3 together, the substrate handlingapparatus 130 has a guide assembly 140 (FIG. 2) to hold a clamp 150 at afixed elevation with respect to the first and second plates 122 and 124along the processing path P₁, and a drive mechanism 160 to operate theguide assembly 140. As described below, the guide assembly 140 and thedrive mechanism 160 shown in FIGS. 2 and 3 provide a durable device thatconsistently moves the clamp 150 along the processing path P₁.

[0029] The embodiment of the guide assembly 140 shown in FIGS. 2 and 3has a fixed guide member 142 attached to the table 112 and an arm 144movably attached to the fixed guide member 142. The fixed guide member142 extends in a direction corresponding to the processing path P₁. Thefixed guide member 142, more particularly, generally extends at leastsubstantially parallel to the processing path P₁ at the side of theprocessing path P₁. In an alternative embodiment (not shown), the fixedguide member 142 can be superimposed above or below the processing pathP₁. In the embodiment illustrated in FIGS. 2 and 3, the fixed guidemember 142 is an elevated beam attached to legs 143 a and 143 b that aremounted to the processing machine 110 proximate to the edge of the table112.

[0030] The arm 144 of the guide assembly 140 translates along the guidemember 142 to move at least a portion of the arm along the processingpath P₁. In the embodiment shown in FIGS. 2 and 3, the arm 144 includesa first arm section 146 slidably attached to the guide member 142 and asecond arm section 148 attached to the first section 146. The first armsection 146, for example, can be a bracket that slides along the guidemember 142, or the first arm section 146 may have a plurality of rollersthat roll along the guide member 142. The second section can have afirst end attached to the first section 146 and a second end projectingfrom the first section 146 to a location either on or superimposed withthe processing path P₁. The second arm section 148, for example, can bea bar projecting from the first arm section 146 transverse to theprocessing path P₁ to position a portion of the second arm section 148over the processing path P₁. The arm 144 can also have an adjustableclamp holder 149 attached to the second end of the second arm section148 to move vertically with respect to the second arm section 148 forpositioning the clamp 150 at the processing path P₁.

[0031] The arm 144 is generally made from a lightweight and rigidmaterial, such as aluminum or suitable plastics. Additionally, thesecond arm section 148 has a sufficient thickness and shape to extendover the processing station 120 a without bending to support the clamp150 at a constant elevation with respect to the processing station 120a. As shown in FIGS. 2 and 3, the arm 144 can be positioned above thefirst plate 122 of the processing station 120 a, and the clamp holder149 can project downwardly from the arm 144 through the slots 125 and127 in the first plate 122 to position the clamp 150 in the plate gap126. In another embodiment (not shown), the second arm section 148 canbe configured to move through the plate gap 126 between the first andsecond plates 122 and 124, and the clamp 150 can be attached directly tothe second end of the second arm section 148 without the clamp holder149. In the embodiment in which the second arm section 148 passesthrough the plate gap 126, the first plate 122 does not necessarily haveslots 125 and 127 because the clamp holder 149 is not attached to thesecond arm section 148.

[0032] The drive mechanism 160 has a motor 161 attached to the table 112and a drive member 170 (indicated by reference numbers 170 a and 170 bin FIGS. 2 and 3). The drive member 170 is coupled to the motor 161 andto the first arm section 146 such that the motor 161 and the drivemember 170 selectably move the first arm section 146 along the guidemember 142 to position the clamp 150 at desired locations along theprocessing path P₁. The motor 161 is generally a servo motor with adrive shaft 162 and a drive sprocket 164 attached to the drive shaft162. The drive sprocket 164 may alternatively be a gear, pulley or othertype of device to operatively engage the particular type of drive member170.

[0033] The embodiment of the drive member 170 shown in FIGS. 2 and 3 hasa first belt 170 a and a second belt 170 b (best shown in FIG. 2).Referring to FIG. 3, the first belt 170 a is engaged with the drivesprocket 164 and a first passive sprocket 170 a mounted to a firstpassive shaft 174 a attached the right leg 143 a. The second belt 170 bis coupled to a second passive sprocket 172 b mounted to the firstpassive shaft 174 a, and the second belt 170 b is coupled to a thirdpassive sprocket 172 c mounted to a second passive shaft 174 b attachedto the left leg 143 b. The second belt 170 b accordingly extends alongthe fixed guide member 142, and an upper portion of the second belt 170b is fixedly attached to the first arm section 146. The first and secondbelts 170 a and 170 b may be similar to timing belts with transversegrooves 175 arranged along the back side of the belts to engage thesprockets 164 and 172 a-172 c. In alternative embodiments, the first andsecond belts 170 a and 170 b can also be regular belts without thetransverse grooves, or they can be chains.

[0034] The drive mechanism 160 moves the arm 144 along the guide member142 between a first position in which the clamp 150 is near the firstside 128 of the processing station 120 a, and a second position in whichthe clamp 150 is near the cassette 114 at the second side 129 of theprocessing station 120 a. To move the clamp 150 along the processingpath P₁ toward the cassette 114 with the drive mechanism 160 shown inFIGS. 2 and 3, the motor 161 rotates the drive sprocket 164counterclockwise (from the perspective of FIG. 2) to rotate the firstpassive shaft 174 a counter-clockwise via the first belt 170 a and thefirst passive sprocket 172 a. The counter-clockwise rotation of thefirst passive shaft 174 a rotates the second passive sprocket 172 bcounter-clockwise to move the upper portion of the second belt 170 btoward the cassette 114. The second belt 170 b accordingly pulls thefirst arm section 146 along the guide member 142 toward the cassette 114to position the clamp 150 in the second position proximate to thecassette 114. The clamp 150 then engages a selected wafer frame 115 inthe cassette 114. After the clamp 150 securely grips the selected waferframe 115, the servo motor 161 rotates the drive sprocket 164 in theclockwise direction to move the first arm section 146 along the guidemember 142 away from the cassette 144 until the clamp 150 is in thefirst position proximate to the first side 128 of the processing station120 a.

[0035] After the handling apparatus positions the substrate assembly 117at the first processing station 120 a, the expander machine 110 shrinksthe thin backing film 116. The backing film 116 accordingly contracts totighten the backing film 116 on the frame 115. The motor 161 thenrotates the drive sprocket 164 counter-clockwise to move the clamp 150into first position for replacing the substrate assembly into thecassette 114. The cassette is incrementally raised or lowered toposition another substrate assembly 117 and frame 115 at the elevationof the clamp, and the process is repeated to tighten the backing filmholding another substrate assembly 117.

[0036]FIG. 4 is an isometric view illustrating one embodiment of theclamp 150 in greater detail. In this embodiment, the clamp 150 has afixed upper jaw 152, a movable lower jaw 154, and an actuator 156operatively coupled to the lower jaw 154. The actuator 156 is generallya pneumatic cylinder, but the actuator 156 can be a hydraulic cylinder,an electric motor or another type of actuator. The actuator 156 movesthe lower jaw 154 with respect to the upper jaw 152 to positively clampor disengage a selected frame 115. For example, when the clamp 150 is inthe second position to remove a substrate 117 from the cassette 114(FIG. 2), the actuator 156 moves the lower jaw 154 upward to clamp theframe 115 between the jaws 152 and 154. Conversely, to replace asubstrate assembly 117 in the cassette 114, the actuator 156 moves thelower jaw 154 downward to disengage the frame 115. The clamp 150accordingly provides positive engagement and disengagement of the frame115 without relying on clips that wear out and may not providesufficient friction against the frame 115.

[0037]FIG. 5 is an isometric view illustrating another clamp 250 withmovable upper and lower jaws 252 and 254. In this embodiment, anactuator 256 is coupled to both the upper and lower jaws 252 and 254.The actuator 256 moves the jaws 252 and 254 toward or away from oneanother for engaging or disengaging a frame 115, respectively, tooperate in a similar manner as the clamp 150. The actuator 256 may alsobe a pneumatic cylinder, a hydraulic actuator, an electric motor or anytype of suitable actuation device.

[0038] The substrate handling apparatus 130 illustrated in FIGS. 2 and 3provides a durable system to avoid down-time for the expander machine110. One aspect of the substrate handling apparatus 130 that makes itdurable is that the guide assembly 140 is generally made from rigid,sturdy components that can withstand the forces and the friction thatoccur when handling substrate assemblies over a period of time.Additionally, the drive member 170 is also a sturdy component, such as atiming belt or chain, that can also withstand the forces of moving asubstrate assembly between the cassette 114 and the processing station120. Thus, compared to existing loaders that support a clamp with athin-tape, the substrate handling apparatus 130 is expected to reducethe down-time for repairing and maintaining expander machines and otherprocessing machines.

[0039] The wafer expander machine 110 is also expected to alleviate theproblems of “shooting the gap” experienced by the conventional expandermachine 10 described in FIG. 1. The guide assembly 140, for example, hasrigid components that do not blend and cause vertical displacement ofthe clamp 150 along the length of the processing path P₁. Moreover, thearm 144 translates along the guide member 142 to move at a constantelevation in a direction at least substantially parallel to theprocessing path P₁. The substrate handling apparatus 130 accordinglyconsistently moves the arm 144 and the clamp 150 along the processingpath. The slots 125 and 127 in the first plate 122 of the firstprocessing station 120 a also receive the clamp holder 149 and the clamp150 at the level of the processing path P₁. The first plate 122accordingly accommodates the clamp 150 so that the clamp holder 149 andthe clamp 150 can move through the plate gap 126 without the possibilityof hitting the first plate 122. Thus, the controlled motion of thesubstrate handling apparatus 130 and the slots 125 and 127 in the firstplate 122 of the processing station 120 a operate together to alleviatethe problem of “shooting the gap” experienced with the conventionalexpanding machines 10 shown in FIG. 1.

[0040] The clamps 150 and 250 illustrated in FIGS. 4 and 5 also providepositive engagement and disengagement of the frames 115 to accuratelyload and unload the frames 115 from the cassette 114. Existing clamps inexisting loaders have spring-type clips that may not provide sufficientfriction to grip the frames because the clips may wear over time. Theclamps 150 and 250 illustrated in FIGS. 4 and 5 overcome this problem byusing an actuator to selectively move the jaws between an engagedposition and a disengaged position. Therefore, the expander machine 110is expected to provide better engagement and disengagement of the waferframes 115 compared to existing expander machines.

[0041]FIG. 6 is an isometric view illustrating an expander machine 210in accordance with another embodiment of the invention. The expandermachine 210 has a cassette 114 and a processing station 120 a similar tothose described above with respect to the expander machine 110. Theexpander machine 210, however, has a different guide assembly with aguide member 242 that is a rail attached directly to the table 112.Additionally, the guide assembly has an arm 244 with a first section 246slidably attached to the guide member 242 and a second arm section 248projecting upward from the first section 246 and transverse to theprocessing path P₁ to locate the clamp 150 along the processing path P₁.The second arm section 248, for example, can be an L-shaped bar toposition the clamp 150 at the processing path P₁. The expander machine210 also has a motor 161 mounted vertically to the table 112 such thatthe drive member 170 wraps around the drive sprocket 164 and a passivesprocket 172. The drive member 170 can be a belt or chain, as describedabove. The drive member 170 is also fixedly attached to the firstsection 246 of the arm 244. Accordingly, the motor 161 rotates the drivesprocket 164 to move the drive member 170 and slide the arm 244 alongthe guide member 242.

[0042]FIG. 7 is an isometric view illustrating an expander machine 310in accordance with another embodiment of the invention. In thisembodiment, the expander machine 310 has a guide assembly with a guidemember 342 that is an elongated slot or channel in the table 112. Theguide assembly also has an arm 344 with a first arm section 346 having akey 347 positioned in the guide member 342, and an L-shaped second armsection 348 attached to the first arm section 346. The motor 161 and theguide member 170 are the same as those described above with reference tothe expander machine 210 shown in FIG. 6.

[0043]FIG. 8 is an isometric view illustrating an expander machine 410in accordance with yet another embodiment of the invention. In thisembodiment, the drive mechanism has a motor 161 with a drive shaft 162,and a threaded drive member 470 coupled to the drive shaft 162. Thedrive member 470 is preferably a ball screw with a freely rotating ball471 received in a block 472 attached to the table 112. The expandermachine 410 also has an arm 444 with a first arm section 446 threadedlycoupled to the drive member 470 and an L-shaped second arm member 448projecting from the first arm member 446. The motor 161 rotates thedrive member 470 to translate the first arm section 446 along the drivemember 470. The drive member 470 accordingly also acts as a guide memberfor the arm 444. The expander machine 410, therefore, combines the guidemember and the drive member into a single component that both guides anddrives the arm 444 along the processing path P₁.

[0044] From the foregoing it will be appreciated that, although specificembodiments of the invention have been described herein for purposes ofillustration, various modifications may be made without deviating fromthe spirit and scope of the invention. For example, the substratehandling apparatuses are described above with reference to expandermachines, but the substrate handling apparatuses can also be used inother processing machines used in the fabrication or packaging ofmicroelectronic devices. Accordingly, the invention is not limitedexcept as by the appended claims.

1. A method for handling a wafer assembly having a frame, a backing filmattached to the frame, and a microelectronic-substrate assembly attachedto the backing film, the method comprising: moving a clamp of asubstrate handling apparatus at an elevation along a processing paththrough a processing station of a processing machine by sliding an armattached to the clamp along a guide member having an elongated shapecorresponding to the processing path, the clamp being selectively movedbetween a first position at a first side of the processing station tohold a substrate assembly at the processing station and a secondposition at a second side of the processing station to grip or release aselected frame and substrate assembly in the cassette; and operating theclamp in the second position by either gripping the selected frame tocarry the substrate assembly from the second position to the firstposition at the processing station, or releasing the selected frame toplace the selected frame and substrate assembly back in the cassette. 2.The method of claim 1 wherein the processing station comprises a firstplate having a slot extending along the processing path and a secondplate spaced apart from the first plate by a plate gap, and the armcomprises a first arm section slidably attached to the guide member anda second arm section attached to the first arm section and extendingtransversely from the from the first arm section to position the clampin the slot of the first plate, and wherein moving the clamp comprisessliding the first arm section along the guide member to move the clampalong the processing path.
 3. The method of claim 1 wherein the guidemember comprises an elongated beam fixedly attached to first and secondlegs projecting from a table of the processing machine, the beam havinga length defining a longitudinal axis and the beam being spaced apartfrom the processing path, the arm comprises a first arm section having abracket slidably attached to the beam to slide along the longitudinalaxis and a second arm section having a bar attached to the bracket andextending transversely from the bracket, and wherein moving the clampcomprises sliding the bracket along the beam.
 4. The method of claim 1wherein the guide member comprises an elongated rail fixedly attached toa table of the processing machine, the rail having a length defining alongitudinal axis and the rail being spaced apart from the processingpath, and the arm comprises a first arm section having a block with aslot receiving the rail to slidably attach the block to the rail and asecond arm section having a bar attached to the block and extendingtransversely from the block, and wherein moving the clamp comprisessliding the block along the rail.
 5. The method of claim 1 wherein theguide member comprises an elongated channel in a table of the processingmachine, the channel having a length defining a longitudinal axis andthe channel being spaced apart from the processing path, and the armcomprises a first arm section having a block with a key received thechannel to slidably attach the block to the table to slide along thechannel and a second arm section having a bar attached to the block, thebar extending upward from the block and transversely with respect to theprocessing path to position the clamp at the processing path, andwherein moving the clamp comprises sliding the block along the channel.6. The method of claim 1 wherein the processing machine furthercomprises a servo motor with a drive shaft and a threaded drive memberattached to the drive shaft of the servo motor, the drive member beingattached to a table of a processing machine and the drive memberextending along the table at least substantially parallel to theprocessing path to also define a guide member, and the arm comprises afirst arm section having block with a threaded hole receiving thethreaded drive member and a second arm section having a bar attached tothe block, the bar extending upward from the block and transversely withrespect to the processing path to position the clamp at the processingpath, and wherein moving the clamp comprises rotating the drive shaftand the threaded drive member to slide the block along the threadeddrive member.
 7. A method of handling a wafer assembly having a frame, abacking film attached to the frame, and a microelectronic-devicesubstrate assembly attached to the backing film, the method comprising:translating an arm along a guide member having an elongated shapeextending along a processing machine at least substantially parallel toa processing path running from a first side of a processing station to asecond side of the processing station proximate to a cassette ofsubstrate assemblies coupled to frames; positioning at least a portionof the arm over the processing path as the arm translates along theguide member; and selectively closing the clamp to grip a selected frameand substrate assembly to carry the selected substrate assembly from thewafer cassette to the processing station, and selectively opening theclamp to release the selected frame and substrate assembly to place theselected substrate assembly back in the cassette.
 8. The method of claim7 wherein the processing station comprises a first plate having a slotextending along the processing path and a second plate spaced apart fromthe first plate by a plate gap, and the arm comprises a first armsection slidably attached to the guide member and a second arm sectionattached to the first arm section and extending transversely from thefrom the first arm section to position the clamp in the slot of thefirst plate, and wherein translating the arm along the guide membercomprises sliding the first arm section along the guide member to movethe clamp along the processing path.
 9. The method of claim 7 whereinthe guide member comprises an elongated beam fixedly attached to firstand second legs projecting from a table of the processing machine, thebeam having a length defining a longitudinal axis and the beam beingspaced apart from the processing path, the arm comprises a first armsection having a bracket slidably attached to the beam to slide alongthe longitudinal axis and a second arm section having a bar attached tothe bracket and extending transversely from the bracket, and whereintranslating the arm along the guide member comprises sliding the bracketalong the beam.
 10. The method of claim 7 wherein the guide membercomprises an elongated rail fixedly attached to a table of theprocessing machine, the rail having a length defining a longitudinalaxis and the rail being spaced apart from the processing path, and thearm comprises a first arm section having a block with a slot receivingthe rail to slidably attach the block to the rail and a second armsection having a bar attached to the block and extending transverselyfrom the block, and wherein translating the arm along the guide membercomprises sliding the block along the rail.
 11. The method of claim 7wherein the guide member comprises an elongated channel in a table ofthe processing machine, the channel having a length defining alongitudinal axis and the channel being spaced apart from the processingpath, and the arm comprises a first arm section having a block with akey received the channel to slidably attach the block to the table toslide along the channel and a second arm section having a bar attachedto the block, the bar extending upward from the block and transverselywith respect to the processing path to position the clamp at theprocessing path, and wherein translating the arm along the guide membercomprises sliding the block along the channel.
 12. The method of claim 7wherein the processing machine further comprises a servo motor with adrive shaft and a threaded drive member attached to the drive shaft ofthe servo motor, the drive member being attached to a table of aprocessing machine and the drive member extending along the table atleast substantially parallel to the processing path to also define aguide member, and the arm comprises a first arm section having blockwith a threaded hole receiving the threaded drive member and a secondarm section having a bar attached to the block, the bar extending upwardfrom the block and transversely with respect to the processing path toposition the clamp at the processing path, and wherein translating thearm along the guide member comprises rotating the drive shaft and thethreaded member to slide the block along the threaded member.
 13. Amethod of handling a wafer assembly having a frame, a backing filmattached to the frame, and a microelectronic-device substrate assemblyattached to the backing film, the method comprising: activating a motoroperatively coupled to an arm to slide the arm in a first directionalong an elongated guide member having a shape extending at leastsubstantially parallel to a processing path of a processing machine, themotor moving the arm in the first direction until a clamp attached tothe arm is positioned adjacent to a selected frame and substrateassembly stored in a cassette adjacent to the processing station;gripping the selected frame with the clamp; re-activating the motor toslide the arm in a second direction along the guide member until theselected frame and substrate assembly are positioned in a plate gapseparating first and second plates of a processing station; processingthe selected frame and substrate assembly in the processing station bytightening the backing film attached to the selected frame; energizingthe motor to slide the arm back in the first direction until theselected frame and substrate assembly are placed back in the cassette;and releasing the clamp from the selected frame.